• 星耀国际

    Finished AOI

    Features

    · Precise numerical control integrated surface RGB shadowless light source

    · All imported 10 million-pixel industrial cameras and lenses

    · The equipment structure is highly integrated, easy to install and maintain, and the interface is easy to operate

    · Online detection, seamless connection with production line MES

    · The three-color algorithm truly restores the color of the cells and realizes high-precision color sorting of the cells

    · Artificial intelligence technology realizes battery defect classification

    · Big data analysis of defect distribution and defect cell distribution


    Color imaging solution: use black and white CCD chip + RGB light source (same as GP)

    · The number of red, green and blue photosensitive pixels is 25 million

    · True color reproduction, high sensitivity, good contrast

    · Natural black and white mode, more accurate color inspection and more advantages in defect detection

    · Imaging is not affected by the color temperature of the light source (or ambient light)


    Other competing imaging solutions: use color CCD chip + white light source

    · Colors are formed by interpolation, not truecolor

    · The number of red and blue photosensitive pixels accounts for 25%, which is equivalent to 6 million

    · The number of green light-sensitive pixels accounts for 50%, which is equivalent to 12 million

    · The color is not bright enough, and the color gamut is limited


    Imaging effect & comparison of advantages and disadvantages


    Plan

    Three-color light + black and white cameraMonochromatic light + color camera
    Number of photos3 photos1 photo
    CT (photographing + processing)850ms

    600ms

    Treatment (color, shape, graphics, defects)

    Synchronous processing, CT does not increase with detection items

    Serial processing, type increase CT increase

    AlgorithmRuili color, accurate sorting: easy to detect surface contamination under red light (such as watermarks)

    The color is not bright enough, and the slight surface contamination cannot be recognized

    Process convenience

    Product switching without changing the underlying

    algorithm

    Product switching needs to change the underlying

    algorithm


    Device parameters


    ProjectSpecification

    Equipment ruler

    Length 430mm Width 390mm Height 780mm
    Applicable Wafer Size156*156mm- 170*170mm
    Applicable Wafer Type

    Monocrystalline, polycrystalline, diamond wire monocrystalline, polycrystalline, PERC cells

    Production capacityUp to 3800PCS/hour
    Front camera pixels/resolution25 million, 34um
    Rear Camera Pixels/Resolution

    20 million, 48um (optional 25 million configuration for easy product upgrade)

    UPTime>99%
    False positive rateAs low as <1%

    False negative rate

    As low as <0.1

    Fragmentation rate

    0%


    Test itemsdefect type
    size measurement

    Side lengths, bends, diagonals, etc.

    Damage detectionDamage, edge chipping, missing corners, grid line damage, cracks, etc.
    printing offsetIncluding overall offset, grid line offset, main grid offset, etc.
    Grid detection

    Including broken grid, thinning, thickening, twisting, virtual printing, etc.

    Dirt detectionContains fingerprints, watermarks, screen dirt, etc.
    Spot detectionBright blue spots, small spots, white spots, dark red spots, slurry leakage, fingerprints, dripping oil, uncoated, diffusion boat prints, etch stains, etc.

    Line Mark

    Detection

    The grid line becomes thicker at the position where the scratch-like defect appears on the grid line

    overshoot

    detection

    Excessive etching on the surface of the product causes dark yellow or dark red color difference

    Color difference

    detection

    Single chip color difference, black silk chip, flower chip, light and dark chip, intra-chip color difference


    Test items

    defect type

    size measurementSide lengths, bends, diagonals, etc.
    electrode offset

    Including up and down offset, left and right offset, etc.

    Electrode

    detection

    Including electrode missing, damaged, warped, etc.
    Dirt detectionContains stains, fingerprints, oil stains, etc.
    Spot detectionmacula, plaque etc.

    Color difference

    detection

    In-chip chromatic aberration, yellowing, etc.